Chiplet Design and Heterogeneous Integration Packaging
John H. Lau
Chiplet Design and Heterogeneous Integration Packaging
John H. Lau
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Description
John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow
Unimicron Technology Corporation, John_Lau@unimicron.com
SPECIALIZED PROFESSIONAL COMPETENCIES
[1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability.
[2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging.
[3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers.
Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures.
For Internal Use Only:
John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow
Unimicron Technology Corporation, John_Lau@unimicron.com
SPECIALIZED PROFESSIONAL COMPETENCIES
[1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability.
[2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging.
[3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers.
Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures.