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Emerging ICT Technologies and Cybersecurity

From AI and ML to Other Futuristic Technologies

Kutub Thakur, Al-Sakib Khan Pathan & Sadia Ismat

Emerging ICT Technologies and Cybersecurity
Emerging ICT Technologies and Cybersecurity

Emerging ICT Technologies and Cybersecurity

From AI and ML to Other Futuristic Technologies

Kutub Thakur, Al-Sakib Khan Pathan & Sadia Ismat

Paperback | English
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Description

This book introduces some fundamentals of information and communication technology (ICT) and other current and future technologies that are relevant to the field of cybersecurity.

Kutub Thakur, Ph.D., is Director of the NJCU Center for Cybersecurity, Assistant Professor, and Director of the Cybersecurity Program at New Jersey City University. He worked for various private and public entities such as the United Nations, New York University, Lehman Brothers, Barclays Capital, ConEdison, City University of New York, and Metropolitan Transport Authority. He received his Ph.D. in Computer Science with a specialization in cybersecurity from Pace University, New York, M.S. in Engineering Electrical and Computer Control systems from the University of Wisconsin, B.S. and A.A.S. in Computer Systems Technology from the City University of New York (CUNY). He reviewed for many prestigious journals and published several papers in reputable journals and conferences. His research interests include digital forensics, network security, machine learning, IoT security, privacy, and user behavior. Dr. Thakur is currently serving as Program Chair for many conferences and workshops. He is also currently supervising many graduate and doctoral students for their theses, proposals, and dissertations in the field of cybersecurity.

Al-Sakib Khan Pathan is Professor at the CSE department, United International University (UIU), Bangladesh. He received his Ph.D. in Computer Engineering in 2009 from Kyung Hee University, South Korea, and his B.Sc. in Computer Science and Information Technology from the Islamic University of Technology (IUT), Bangladesh, in 2003. In his academic career so far, he worked as Faculty Member in the CSE Department at the Independent University, Bangladesh (2020-2021), Southeast University, Bangladesh (2015-2020), Computer Science Department, International Islamic University Malaysia (IIUM), Malaysia, during 2010-2015; at BRACU, Bangladesh, during 2009-2010; and at NSU, Bangladesh, during 2004-2005. He has served as General Chair, Organizing Committee Member, and Technical Program Committee Member in numerous international conferences/workshops like INFOCOM, GLOBECOM, ICC, etc. He was awarded the IEEE Outstanding Leadership Award for his role in the IEEE GreenCom’13 conference. Among various editorial roles, he is currently serving as Editor-in-Chief of the International Journal of Computers and Applications, T&F; Associate Editor of Connection Science, T&F; Editor of Ad Hoc and Sensor Wireless Networks, Old City Publishing, and International Journal of Sensor Networks, Inderscience Publishers; Guest Editor of many special issues of top-ranked journals; and Editor/Author of 32 books. He is Senior Member of IEEE.

Sadia Ismat has been serving government agencies for the last two decades. She has held multiple executive positions. Currently, she is working as Chief Information Security Officer (CISO) at the Department of Finance, New York City's largest financial municipal agency which has a collective revenue annually of 65 billion dollars. Dr. Sadia has worked for various state and city agencies, providing consulting services to government and private firms throughout her career. She is Regular Contributor and Speaker in Cybersecurity Conferences discussing Cybersecurity and Women in Cybersecurity. Dr. Ismat published research works encompassing federal compliance and biometric technology. She also works as Adjunct Professor at various city and private universities.

Specifications

  • Publisher
    Springer International Publishing AG
  • Pub date
    Apr 2024
  • Theme
    Artificial intelligence
  • Dimensions
    235 x 155 mm
  • EAN
    9783031277672
  • Paperback
    Paperback
  • Language
    English

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