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Lifetime Reliability-aware Design of Integrated Circuits

Mohsen Raji & Behnam Ghavami

Lifetime Reliability-aware Design of Integrated Circuits
Lifetime Reliability-aware Design of Integrated Circuits

Lifetime Reliability-aware Design of Integrated Circuits

Mohsen Raji & Behnam Ghavami

Paperback | English
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Description

They address modeling approaches and techniques for evaluation and improvement of lifetime reliability for nano-scale CMOS digital circuits, as well as design algorithms that are the cornerstone of Computer Aided Design (CAD) of reliable VLSI circuits.

Mohsen Raji received his Ph.D. degree in computer engineering from Amirkabir University of Technology, Tehran, Iran. He has been serving as a faculty member in School of Electrical and Computer Engineering, Shiraz University, Shiraz, Iran, since 2015. He teaches courses such as VLSI systems design, microprocessors, embedded systems, fault tolerant system design. He has supervised or co-supervised about 10 graduate students and published over 30 refereed papers. He is serving as an associated editor of Iranian Journal of Science and Technology, Transactions of Electrical Engineering. His current research interests include dependable computing, reliable and robust logic designs, design automation of digital systems, and embedded systems.

 

Behnam Ghavami was born in Esfarayen, Iran. He received his Ph.D. degree in computer engineering from Amirkabir University of Technology, Tehran, Iran. He has been serving as a Faculty Member with the Computer Engineering Department, Shahid Bahonar University of Kerman, since 2010, where he is currently an Associate Professor. He teaches courses in design and test of digital systems, computer architecture, embedded processor design, and reliable circuit design. He has supervised or co-supervised about 20 graduate students. He has published over 100 refereed papers. His research interests include the design automation of digital systems, computer architecture, statistical analysis, robust logic designs, and embedded processors. He is currently an Associate Editor of the Journal of Electronic Testing-Springer and Microelectronics Journal-Elsevier. He has a decade of industry experience, including working on FPGA in automotive industry.

Specifications

  • Publisher
    Springer International Publishing AG
  • Pub date
    Nov 2023
  • Theme
    Electronics: circuits and components
  • Dimensions
    235 x 155 mm
  • Weight
    201 gram
  • EAN
    9783031153471
  • Paperback
    Paperback
  • Language
    English