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Dian Ci Chao Sheng Dao Bo Cheng Xiang Li Lun Yu Fang Fa

Songling Huang, Yu Zhang, Zheng Wei, Shen Wang & Hongyu Sun

Dian Ci Chao Sheng Dao Bo Cheng Xiang Li Lun Yu Fang Fa
Dian Ci Chao Sheng Dao Bo Cheng Xiang Li Lun Yu Fang Fa

Dian Ci Chao Sheng Dao Bo Cheng Xiang Li Lun Yu Fang Fa

Songling Huang, Yu Zhang, Zheng Wei, Shen Wang & Hongyu Sun

Paperback | English
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€118.95
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Description

Written by respected experts, this book highlights the latest findings on the electromagnetic ultrasonic guided wave (UGW) imaging method. It introduces main topics as the Time of Flight (TOF) extraction method for the guided wave signal, tomography and scattering imaging methods which can be used to improve the imaging accuracy of defects.

Songling Huang received the bachelor’s degree in automatic control engineering from Southeast University, Nanjing, China, in 1991, and the Ph.D. degree in nucle ar application technology from Tsinghua University, Beijing, China, in 2001. He is currently a Professor within the Department of Electrical Engineering, Tsinghua University. He is the director of the Electromagnetic Testing and Equipment Safety Assessment Research Center of Tsinghua University, the executive director of the China Non-Destructive Testing Society, and the executive director of the Equipment Structure Health Monitoring and Prognostics Society. His research interests include nondestructive evaluation and instrument techniques.
Yu Zhang received the bachelor’s degree from North China Electric Power University in 2013, and the Ph.D. degree with the Department of Electrical Engineering from Tsinghua University in 2017. His research interests include nondestructive testing and evaluation.
Zheng Wei received the bachelor’s degree from Tsinghua University in 2009, and the Ph.D. degree with the Department of Electrical Engineering from Tsinghua University in 2015. His research interests include nondestructive testing and evaluation.
Shen Wang received the bachelor’s and Ph.D. degrees in electrical engineering from Tsinghua University, Beijing, China, in 2002 and 2008, respectively. He is currently an Associate Professor within the Department of Electrical Engineering, Tsinghua University. His research interests include nondestructive testing and evaluation, and virtual instrumentation.
Hongyu Sun received the bachelor’s degree from the Department of Renewable Energy, North China Electric Power University, Beijing, China, in 2015, and the master’s degree from the department of Electrical and Electronic Engineering, North China Electric Power University, Beijing, China, in 2018. He is currently pursuing the Ph.D. degree within the Department of Electrical Engineering, Tsinghua University. His major research interests include electromagnetic measurement, nondestructive evaluation, and plasma physics.

Specifications

  • Publisher
    Springer Verlag, Singapore
  • Pub date
    Aug 2020
  • Theme
    Electronics engineering
  • Dimensions
    235 x 155 mm
  • Weight
    462 gram
  • EAN
    9789811386046
  • Paperback
    Paperback
  • Language
    English

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