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Wafer Level 3-D ICs Process Technology

Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology

Wafer Level 3-D ICs Process Technology

Hardback / bound | English
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Description

Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost.

Specifications

  • Publisher
    Springer-Verlag New York Inc.
  • Pub date
    Sep 2008
  • Theme
    Electronics engineering
  • Dimensions
    235 x 155 mm
  • EAN
    9780387765327
  • Hardback / bound
    Hardback / bound
  • Language
    English

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