Albert Camus
Resultaten voor 'mus'
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Introduction to Solid Modeling Using SOLIDWORKS 2026: Evergreen Release ISE
William "Ed" Howard holds a B.S. in civil engineering and an M.S. in engineering mechanics from Virginia Tech, and a Ph.D. in mechanical engineering from Marquette University. He is an associate professor in the East Carolina University Department of Engineering, where he teaches solid modeling, engineering computations, solid mechanics, and composite materials. Before beginning his academic career, Dr. Howard worked in industry for 14 years in design, analysis, and project engineering at Thiokol Corporation (Brigham City, UT), Spaulding Composites Company (Smyrna, TN), and Sta-Rite Industries (Delavan, WI). He is a registered professional engineer in the state of Wisconsin. Joseph Musto holds a B.S. from Clarkson University, and an M.Eng. and Ph.D. from Rensselaer Polytechnic Institute, all in mechanical engineering. Before beginning his academic career, Dr. Musto worked in industry in held industrial positions with Brady Corporation (Milwaukee, WI) and Eastman Kodak Company (Rochester, NY). He is a registered professional engineer in the state of Wisconsin. He has been using and teaching solid modeling using SOLIDWORKS since 1998.
€ 82,95 -
Summer of Simulation
50 Years of Seminal Computer Simulation Research€ 152,50 -
IC Interconnect Analysis
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components.
€ 180,50 -
Proceedings of the 7th International Conference on Discrete Element Methods
This book presents the latest advances in Discrete Element Methods (DEM) and technology. It is the proceeding of 7th International Conference on DEM which was held at Dalian University of Technology on August 1 - 4, 2016. The subject of this book are the DEM and related computational techniques such as DDA, FEM/DEM, molecular dynamics, SPH, Meshless methods, etc., which are the main computational methods for modeling discontinua. In comparison to continua which have been already studied for a long time, the research of discontinua is relatively new, but increases dramatically in recent years and has already become an important field. This book will benefit researchers and scientists from the academic fields of physics, engineering and applied mathematics, as well as from industry and national laboratories who are interested in the DEM.
€ 212,50 -
Proceedings of the 7th International Conference on Discrete Element Methods
This book presents the latest advances in Discrete Element Methods (DEM) and technology. It is the proceeding of 7th International Conference on DEM which was held at Dalian University of Technology on August 1 - 4, 2016. The subject of this book are the DEM and related computational techniques such as DDA, FEM/DEM, molecular dynamics, SPH, Meshless methods, etc., which are the main computational methods for modeling discontinua. In comparison to continua which have been already studied for a long time, the research of discontinua is relatively new, but increases dramatically in recent years and has already become an important field. This book will benefit researchers and scientists from the academic fields of physics, engineering and applied mathematics, as well as from industry and national laboratories who are interested in the DEM.
€ 213,99 -
IC Interconnect Analysis
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of their relevance to the overall circuit behavior, the interconnect can now have a dominant impact on the IC area and performance. Beginning in the late 1980's there was significant research toward better modeling and characterization of the resistance, capacitance and ultimately the inductance of on-chip interconnect. IC Interconnect Analysis covers the state-of-the-art methods for modeling and analyzing IC interconnect based on the past fifteen years of research. This is done at a level suitable for most practitioners who work in the semiconductor and electronic design automation fields, but also includes significant depth for the research professionals who will ultimately extend this work into other areas and applications. IC Interconnect Analysis begins with an in-depth coverage of delay metrics, including the ubiquitous Elmore delay and its many variations. This is followed by an outline of moment matching methods, calculating moments efficiently, and Krylov subspace methods for model order reduction. The final two chapters describe how to interface these reduced-order models to circuit simulators and gate-level timing analyzers respectively. IC Interconnect Analysis is written for CAD tool developers, IC designers and graduate students.
€ 160,49