Microelectronics Packaging Handbook, 3-part set
Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging
R.R. Tummala, Eugene J. Rymaszewski & Alan G. Klopfenstein
Microelectronics Packaging Handbook, 3-part set
Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging
R.R. Tummala, Eugene J. Rymaszewski & Alan G. Klopfenstein
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Engels
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Omschrijving
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages.
`A most comprehensive book set, both well presented and well illustrated.'
IEEE Electrical Insulation Magazine, September/October 1997