Modeling and Simulation for Microelectronic Packaging Assembly – Manufacturing, Reliability and Testing
Shen Liu & Yong Liu
Modeling and Simulation for Microelectronic Packaging Assembly – Manufacturing, Reliability and Testing
Shen Liu & Yong Liu
Overig digitaal
|
Engels
€ 122,95
- Vanaf €15,- geen verzendkosten.
- 30 dagen ruiltermijn voor fysieke producten
Omschrijving
An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.